25Q32FV – W25Q32FV

Part Number : 25Q32FV

Function : W25Q32FV

Manufactures : Winbond

Images :

1 page
25Q32FV image

2 page
pinout

Description :

W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: OCtober 15, 2012 Revision D W25Q32FV Table of Contents 1. GENERAL DESCRIPTIONS. 5 2. FEATURES. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS. 6 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil 6 3.2 Pad Configuration WSON 6×5-mm / 8×6-mm 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6×5-mm / 8×6-mm 6 3.4 Pin Configuration SOIC 300-mil . 7 3.5 Pin Description SOIC 300-mil. 7 3.6 Ball Configuration TFBGA 8×6-mm (5×5 or 6×4 Ball Array) . 8 3.7 Ball Description TFBGA 8×6-mm . 8 3.8 Pin Configuration PDIP 300-mil 9 3.9 Pin Description PDIP 300-mil . 9 4. PIN DESCRIPTIONS 10 4.1 Chip Select (/CS) 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3). 10 4.3 Write Protect (/WP) 10 4.4 HOLD (/HOLD) . 10 4.5 Serial Clock (CLK) 10 4.6 Reset (/RESET) 10 5. BLOCK DIAGRAM 11 6. FUNCTIONAL DESCRIPTIONS . 12 6.1 SPI / QPI Operations 12 6.1.1 Standar [.]

3 page
image

25Q32FV Datasheet



This entry was posted in Uncategorized. Bookmark the permalink.