KLM8G2FE3B-B001 PDF – e.MMC, 8GB Memory

Part Number: KLM8G2FE3B-B001

Function: e.MMC

Package: 153FBGA Type

Manufacturer: Samsung




Rev. 1.0, Oct. 2011 KLMxGxFE3B-x00x Samsung e·MMC Product family e.MMC 4.41 Specification compatibility datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an “AS IS” basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2011 Samsung Electronics Co., Ltd. All rights reserved. -1- KLMxGxFE3B-x00x datasheet Rev. 1.0 e·MMC Revision History Revision No. 0.0 0.1 0.5 1.0 History 1. Initial issue 1. User Density Ratio & Part No. of 4GB are changed in Chapter1.0 2. Package Dimension(11.5mm x 13mm x 1.0mm ) Typo is corrected. 3. Max. size of Boot Partition 1,2 and RPMB is changed in Table 28. 4. Typ. Standby Current of NAND is changed to 15uA per chip in Chapter 8.2 1. Engineering Sample 2. SEC_COUNT and MAX_ENH_SIZE_MULT are changed in Chapter 6.4 3. Max. Write Timeout is changed in Chapter 7.1 4. Wakeup Time from Sleep Mode is added in Chapter 5.1.6 5. Remarks of Init, Runtime bad block and remain reserved block per bank in Smart Report Output data are changed in Chapter 5.2.2 1. Typo of Product Name Table is changed in Chapter 6.2.1 2. Performance is updated with measured value in Chapter 5.2.3 3. Read Latency after High Priority Interrupt and Typ. Value of Time Parameter are deleted in Chapter 7.1 4. Wakeup Time from APS Mode and Sleep Mode is deleted in Table 26 5. User Density(%) of 4GB is modified in Chapter 1.0 Draft Date Jun. 01, 2011 Aug. 05, 2011 Sep. 01, 2011 Oct. 12, 2011 Remark Target Target Preliminary Final Editor S.M.Lee S.M.Lee S.M.Lee S.M.Lee -2- KLMxGxFE3B-x00x datasheet Revision History Appendix(0.1) Before(ver.0.0) After(ver.0.1) Rev. 1.0 e·MMC -3- KLMxGxFE3B-x00x datasheet Revision History Appendix(0.5) Before(ver.0.1) After(ver.0.5) Rev. 1.0 e·MMC -4- KLMxGxFE3B-x00x datasheet Revision History Appendix(1.0) Before(ver.0.5) After(ver.1.0) Rev. 1.0 e·MMC -5- KLMxGxFE3B-x00x datasheet Rev. 1.0 e·MMC Table Of Contents 1.0 PRODUCT LIST […]


KLM8G2FE3B-B001 Datasheet