Part Number: THGBMBG5D1KBAIL
Function: 4GB density of e-MMC Module
Package: 153ball BGA Type
THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use.
THGBMBG5D1KBAIL Interface THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package) […]