THGBMBG5D1KBAIL – 4GB density of e-MMC Module


Function : 4GB density of e-MMC Module

Manufactures : Toshiba

Images :

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Description :

THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use. Features THGBMBG5D1KBAIL Interface THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package) 14 NC 13 NC 12 NC 11 NC 10 NC NC NC VSF VSF RFU Vss Vcc RFU NC NC RFU 9 NC NC NC VSF Vcc NC NC NC 8 NC NC NC RFU Vss NC NC NC Top View 7 RFU NC NC Vss RFU NC NC RFU 6 Vss DAT7 VccQ Vcc RFU CLK NC VssQ 5 DAT2 DAT6 NC RFU Vcc Vss DS Vss RST_n CMD VssQ VccQ 4 DAT1 DAT5 VssQ NC index VccQ VccQ V […]

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