The Part Number is D10.
The function of this semiconductor is Memory Micromodules
Package: General Information for D1/ D2 and C Packaging.
Manufacturer: STMicroelectronics
Preview images :
Description
Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card.
The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels.
These contain all of the chips from a number of wafers, including those chips that were found to be
non-functioning during testing. Traceability is ensured by a label fixed on the reel.
Features:
1. Micromodules were developed specifically for embedding in Smartcards and Memory Cards
2. The Micromodule provides:
– Support for the chip
– Electrical contacts
– Suitable embedding interface for gluing the module to the plastic package
3. Physical dimensions and contact positions compliant to the ISO 7816 standard
4. Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between the indexing holes.)
D10 PDF Datasheet
