Part Number: THGBMBG5D1KBAIL
Function: 4GB density of e-MMC Module
Package: 153ball BGA Type
Manufacturer: Toshiba
Images:
Description
THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use.
e-MMC, which stands for “embedded MultiMediaCard,” is a type of embedded memory storage module commonly used in electronic devices and systems to provide non-volatile storage capabilities. e-MMC modules integrate NAND flash memory, a flash controller, and other essential components into a single package.
Features
THGBMBG5D1KBAIL Interface THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package) […]
Application Examples:
e-MMC modules are commonly used in smartphones, tablets, digital cameras, set-top boxes, smart TVs, industrial automation equipment, medical devices, automotive infotainment systems, and other embedded systems requiring non-volatile storage.
THGBMBG5D1KBAIL PDF Datasheet
