KLM8G1WEMB-B031 Datasheet – 8GB eMMC, NAND Flash Memory

Part Number: KLM8G1WEMB-B031

Function: 8GB eMMC, NAND Flash Memory

Package  : FBGA QDP type

Manufacturer: Samsung

Image

klm8g1wemb-b031-nand-flash-memory

Description

1. Density of 4 GB to 128 GB : Contributes to a variety of mobile & consumer designs

2. Small size : Helps meet today’s mobile design requirements, Frees up space for other components

3. Enhanced storage capabilities : Enhances robust mobile devices, Enables traditional storage media to be replaced by lower-power SSDs

4. Advanced embedded NAND Flash :  Helps simplify mass storage designs, Aids in expanding computing power and content storage, Is designed for easier adoption

5. Standard, mature interface by JEDEC
Provides strong power management and performance optimization, Open, Standard Specifications for device features, function, and package pinout

 

Ordering Information

klm8g1wemb-b031-datasheet-samsung
Official Homepage: http://www.samsung.com/semiconductor/

KLM8G1WEMB-B031 Datasheet


 

 

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25Q64FV Datasheet – 64M-bit, Serial Flash Memory – Winbond

This is one of the memory ic types.

Part Number: 25Q64FV, W25Q64FV

Function : SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Package: SOP 8 Pin Type

Manufacturer: Winbond Electronics

See the preview image and the PDF file for more information.

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25Q64FV serial flash memory
Description

The 25Q64FV (64M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 4mA active and 1µA for power-down. All devices are offered in space saving packages.

The 25Q64FV array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64FV has 2,048 erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage.

 

25Q64FV Pinout

25Q64FV datasheet pdf pinout

Space Efficient Packaging

1. 8-pin SOIC/VSOP 208-mil
2. 8-pad WSON 6×5-mm/8×6-mm
3. 16-pin SOIC 300-mil
4. 8-pin PDIP 300-mil
5. 24-ball TFBGA 8×6-mm
6. Contact Winbond for KGD and other options

 

25Q64FV Datasheet


 

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