24C02 PDF Datasheet – 2Kbit, SERIAL CMOS EEPROM

EEPROM is non-volatile, which means it can retain data even when the power is turned off. This property is in contrast to volatile memories like RAM (Random Access Memory), which lose data when power is removed.

Part Number: 24C02 ( 24C01 Thru 24C16 )

Function: 2Kbit Serial I²C bus EEPROM

Package: DIP 8 Pin, SO 8, TSSOP 8 pin Type

Manufacturer: ST,  ISSI

24C02 pdf eeprom

Description

24C02 is 2Kbit Serial I²C bus EEPROM. (Electrically Erasable PROgrammable Memory)

EEPROMs like the 24C02 are non-volatile memory devices, meaning they can retain data even when the power is turned off. They are widely used in various electronic systems for storing configuration data, calibration data, or other small amounts of non-volatile information. The 24C02, with its 2-kilobit capacity, is commonly used in low-power applications, such as small microcontroller-based projects, sensors, and other embedded systems where a small amount of non-volatile memory is required.

Features

• Low Power CMOS Technology
– Standby Current less than 8 µA (5.5V)
– Read Current (typical) less than 1 mA (5.5V)
– Write Current (typical) less than 3 mA (5.5V)

• Flexible Voltage Operation
– Vcc = 1.8V to 5.5V for –2 version
– Vcc = 2.5V to 5.5V for –3 version

• 400 KHz (I2C Protocol) Compatibility

• Hardware Data Protection
– Write Protect Pin

• Sequential Read Feature

• Filtered Inputs for Noise Suppression •

• Self time write cycle with auto clear 5 ms @ 2.5V

24C02 datasheet pinout

 

24C02 PDF Datasheet

25Q32FV PDF – 32M-bit Serial Flash Memory (W25Q32FV)

Part Number: 25Q32FV, W25Q32FV

Function: 32M-bit Serial Flash Memory

Package: DIP 8, SOIC 8 Pin Type

Manufacturer: Winbond

Images:25Q32FV winbond

Description

 

W25Q32FV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: OCtober 15, 2012 Revision D W25Q32FV Table of Contents 1. GENERAL DescriptionS. 5 2. Features. 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS. 6 3.1 Pin Configuration SOIC 208-mil / VSOP 208-mil 6 3.2 Pad Configuration WSON 6×5-mm / 8×6-mm 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6×5-mm / 8×6-mm 6 3.4 Pin Configuration SOIC 300-mil . 7 3.5 Pin Description SOIC 300-mil. 7 3.6 Ball Configuration TFBGA 8×6-mm (5×5 or 6×4 Ball Array) . 8 3.7 Ball Description TFBGA 8×6-mm . 8 3.8 Pin Configuration PDIP 300-mil 9 3.9 Pin Description PDIP 300-mil . 9 4. PIN DescriptionS 10 4.1 Chip Select (/CS) 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3). 10 4.3 Write Protect (/WP) 10 4.4 HOLD (/HOLD) . 10 4.5 Serial Clock (CLK) 10 4.6 Reset (/RESET) 10 5. BLOCK DIAGRAM 11 6. FUNCTIONAL DescriptionS . 12 6.1 SPI / QPI Operations 12 6.1.1 Standar [ … ]

25Q32FV datasheet memory

25Q32FV PDF Datasheet