F9540N Datasheet PDF – 100V, HEXFET Power MOSFET

Part Number: IRF9540N

Function: Vdss = -100V, HEXFET Power MOSFET

Package: TO-220AB

Manufacturer: IR ( International Rectifier ), Infineon ( https://www.infineon.com/ )

Images

F9540N MOSFET Transistor

Description

Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

 

Pinout

F9540N datasheet pinout

Features

1. Advanced Process Technology

2. Dynamic dv/dt Rating

3. 175°C Operating Temperature

4. Fast Switching

5. P-Channel

6. Fully Avalanche Rated

The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.

 

F9540N Datasheet

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KLMAG2WEPD-B031 – eMMC, NAND Flash Memory

Part Number: KLMAG2WEPD-B031

Function: 16GB, eMMC ( Managed NAND Flash Memory )

Package: 153FBGA Type ( 11.5mm x 13mm x 0.8mm )

Manufacturer: Samsung

Images:

KLMAG2WEPD-B031 pdf memory

Description

KLMAG2WEPD-B031 is one of Samsung Electronics’ eMMC (embedded MultiMediaCard) products, mainly used in devices such as smartphones, tablets, and embedded systems. This product is designed to integrate NAND flash memory and a memory controller as built-in memory, allowing users to easily store and manage data.

e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF or VCC) whereas 1.8V or 3V dual supply voltage (VDD or VCCQ) is supported for the MMC controller. SAMSUNG e•MMC supports 200MHz DDR – up to 400MBps with bus widths of 8 bit in order to improve sequential bandwidth, especially sequential read performance.

Features

1. embedded MultiMediaCard Ver. 5.0 compatible.Detail description is referenced by JEDEC Standard

2. SAMSUNG e·MMC supports features of eMMC5.0 which are defined in JEDEC Standard

– Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200

– Non-supported Features : Large Sector Size (4KB)

3. Additional features of eMMC5.0 : HS400 mode (200MHz DDR – up to 400Mbps), Field Firmware Update, Device Health Report, Sleep Notification, Secure Removal Type

4. Full backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-e·MMC systems)

5. Data bus width : 1bit (Default), 4bit and 8bit

6. MMC I/F Clock Frequency : 0 ~ 200MHz

7. MMC I/F Boot Frequency : 0 ~ 52MHz

 

Products and specifications discussed herein are for reference purposes only.

 

KLMAG2WEPD-B031 Datasheet