Part Number: TCC8900

Function: High Performance and Low-Power Processor

Package: 400 Solder Balls

Manufacturer: TeleChips

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Description

The TCC8900 is the system LSI for digital multimedia applications based on ARM1176JZ(F)-S, ARM’s proprietary 32-bit RISC CPU core. It can decode and encode various types of audio/video standards with software and dedicated hardware accelerators – MP3 / AAC / MPEG4-AAC / MPEG4-BSAC, JPEG / MPEG1 / MPEG2 / MPEG4-SP/ASP / H.264 / VC-1 / Real Video and other types of audio/video standard. The on-chip USB2.0 OTG controller enables the data transmission between a personal computer and storage device such as NAND flash, HDD, CD, SD, MMC and Memory Stick etc, which can be controlled by the TCC8900.

Pinout

Features

1. 32 Bits ARM1176JZ(F)-S RISC CPU Core for System and Audio Processing

(1) 16KB/16KB Instruction and Data Caches
(2) MMU Supported
(3) Java Acceleration Supported
(4) 16KB Instruction TCM(Tightly Coupled Memory for Exception Handler)
(5) 16KB Data TCM (Tightly Coupled Memory for Fast Data Transfer H/W)
(6) JTAG interface for code debugging

2. MEMORY ORGANIZATION

(1) Boot ROM of 16Kbytes for various boot procedure (HPI BOOT, NAND, USB) and security
(2) Internal SRAM of 16KB for program shared memory with hardware
(3) Memory controller for various memories including PROM, NOR type Flash, SRAM, and SDRAM etc.

TCC8900 Datasheet PDF

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Part Number: MT6575

Function: ARM-based SoC for entry-level Android smartphones and tablets.

Package: 12.2×12.2mm 537 balls, BGA

Manufacturer: Mediatek

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Description

This is Processor for Smartphone. The chip manufactured using 40 nm process technology. The CPU has a -core configuration divided into clusters. The first cluster ARM Cortex-A9 is the most high-performance with one core working at 1.0 GHz. The SoC supports 64-bit data. PowerVR SGX531 GPU is responsible for working with graphics. Modem allows you to download and send data at a speed 0 MBit/s and 0 MBit/s.

1. Model Cortex-A9
2. Release date 2012
3. CPU configuration 1×1.0 GHz ARM Cortex-A9
4. Instruction set architecture ARMv8-A
5. Frequency 1000 MHz
6. Cores 1
7. Word Size 32 bit
8. Process 40 nm

 

Block Diagram :

MT6575 Platform – Key Features

1. Highly-integrated 40nm AP/modem SoC for mainstream smartphones
– High performance 1GHz Cortex-A9 MCU with
• 32K/32K L1 Cache, 256 KB L2 Cache, NEON co-proc.
– Rel. 6 HSPA modem (7.2/5.76 Mbps) integrated
– Stand-alone advanced PMIC (MT6329)

2. Advanced multi-media subsystem
– High-definition 720p, 30fps video encode/decode
– 8 MP@13fps camera with integrated ISP and rich features
– Improved 3D Graphics (OpenGL ES 1.1/2.0) performance
– qHD (960×540)/24-bit Color Display Controller with
• HDMI/MHL support via external component
– Flash 10.3, Stereo 3D image/video/display support

Detail Features

1. Package: 12.2×12.2mm 537 balls, BGA, 0.4mm, 40nm
2. Apps Processor : Cortex-A9@ 1GHz w/ 32KB/32KB I/D cache, 256KB L2, DVFS support , Serial Debug Port
3. Modem Processor : ARM1176JFS@ 520 MHz, 260MHz DSP,96K L2
4. Modem : EDGE class12, HSDPA Cat8 7.2Mbps, HSUPA Cat6 5.76Mbps
5. Memory : 200MHz-mDDR, 256MB , NAND (NFI) , LPDDR2 ,PCDDR3
6. Camera / TV-out : 8MP Bayer/YUV, 10bit parallel, MIPI CSI-2 CVBS TV out
7. Display : qHD, 24-bit color, MIPI DSI(video), NFI, CPU/RGB I/F,3D,HDMI
8. Audio : 64-Poly, MP3,AAC,HE-AAC, WMA,G.711,G.723.1,G.729,AWB+,3D effect Dual mic, Digital mic support
9. Power Management : External PMU, 5 bucks, 21 LDOs, LED driver, pulse charger, gas gauge, Flash LED, Audio AMP, Analog SW, ISINK , 35V Boost controller, DVS Control, PA Control , Force Power Reset , Precharge indicator , 2 Key support

Reference site : https://www.eetimes.com/document.asp?doc_id=1317000

MT6575 Datasheet

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