D10 PDF Datasheet – Memory Micromodule

The Part Number is D10.

The function of this semiconductor is Memory Micromodules

Package: General Information for D1/ D2 and C Packaging.

Manufacturer: STMicroelectronics

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Description

Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card.

The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels.
These contain all of the chips from a number of wafers, including those chips that were found to be
non-functioning during testing. Traceability is ensured by a label fixed on the reel.

D10 datasheet

Features:

1. Micromodules were developed specifically for embedding in Smartcards and Memory Cards

2. The Micromodule provides:
– Support for the chip
– Electrical contacts
– Suitable embedding interface for gluing the module to the plastic package

3.  Physical dimensions and contact positions compliant to the ISO 7816 standard

4.  Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard
35 mm tape in the spacing distance between the indexing holes.)

D10 PDF Datasheet