Part Number: NN5199K
Function: Silicon Multi Chip IC / IC for Color TV
Package: DIP 52 PIN Plastic ( Shrunk Type )
Manufacturer: Panasonic Corporation, Matsushita Electronics corporation
Image :
Description
This is Multi-System Color TV Signal Processor (Built-in I2C Bus Interface).
Pin
Description
1. Test
2. SCL
3. Chroma APC Filter
4. ABCL
5. Ys INPUT
6. External R INPUT
7. External G INPUT
8. External B INPUT
9. VCC1 ( VCJ )
10. R OUTPUT
11. G OUTPUT
12. B OUTPUT
13. GND( VCJ )
14. CHROMA VCXO1 ( 4.43 MHz )
15. N.C
16. VCC1 ( VIF/SIF )
17. N.C
18. VIF INPUT(1)
19. VIF INPUT(2)
20. GND ( VIF/SIF )
21. QIF INPUT
22. RF AGC OUPUT
23. AFT OUTPUT
24. EXTERNAL VIDEO / CHROMA INPUT
25. IF AGC FILTER
26. VIF APC FILTER
27. QIF DETECT OUTPUT
28. SIF INPUT
29. EXTERNAL AUDIO INPUT
30. AUDIO OUTPUT
31. BLACK LEVEL DETECT FILTER
32. DE-EMPHASIS FILTER / AUDIO MONITOR OUTPUT
33. VCC1 ( CHROMA )
34. VIF DETECT OUTPUT
35. VCC3 ( DAC )
36. VIDEO OUPUT
37. TEST2
38. Y INPUT / VERTICAL SYNC. INPUT
39. HORIZONTAL SYNC. INPUT
40. CHROMA VCXO2 ( 3.58 MHz )
41. VCC2 ( HORIZONTAL VCC )
42. HORIZONTAL PULSE OUTPUT
43. HORIZONTAL AFC1 FILTER
44. AUDIO DE-COUPLING FILTER
45. VERTICAL SAW TOOTH
46. VERTICAL OUTPUT
47. VERTICAL AGC FILTER
48. VDD ( CMOS )
49. SCP / CW OUTPUT / X-RAY
50. VSS ( CMOS )
51. SDA
52. FBP INPUT
Structure :
1. Chip surface passivation : SIN
2. Lead frame material : Cu group
3. Internal lead surface treatment : Ag plating
4. External lead surface treatment : Solder dip
5. Chip mounting method : Ag paste
6. Wire bonding method : Thermosonic bonding
7. Wire material, diameter : Au, Diameter : 30 um
8. Mode material : Epoxy
9. Molding method : Multipluger mold
NN5199K Datasheet PDF Download
