K9GAG08U0E Datasheet – 16Gb NAND Flash Memory – Samsung

Part Number: K9GAG08U0E (16Gb), K9LBG08U0E(32Gb), K9HCG08U1E(64Gb)

Function : 16Gb E-die NAND Flash – Multi-Level-Cell (2bit/cell)

Package: 48TSOP1 Type

Manufacturer: Samsung

Image

k9gag08u0e-nand-flash-memory

Description

The device is offered in 3.3V Vcc. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. A program operation can be performed in typical 1.2ms on the 8,628-byte page and an erase operation can be performed in typical 1.5ms on a (1M+54.5K)byte block. Data in the data register can be read out at 30ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9GAG08U0E′s extended reliability of P/E cycles which are presented in the Qualification report by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9GAG08U0E is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.

 

Pinout

k9gag08u0e-datasheet-pinout

 

Features

1. Voltage Supply
– 3.3V Device : 2.7V ~ 3.6V

2. Organization
– Memory Cell Array : (2,076M x 110.49K) x 8bit
– Data Register : (8K + 436) x 8bit

3. Automatic Program and Erase
– Page Program : (8K + 436)Byte
– Block Erase : (1M + 54.5K)Byte

4. Page Read Operation
– Page Size : (8K + 436)Byte
– Random Read : 400μs(Max.)
– Serial Access : 30ns(Min.)

5. Memory Cell : 2bit / Memory Cell

6. Fast Write Cycle Time
– Program time : 1.2ms(Typ.)
– Block Erase Time : 1.5ms(Typ.)

 

K9GAG08U0E Datasheet


 

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H27UBG8T2BTR-BC Datasheet – 32Gb MLC NAND Flash – Hynix

Part Number: H27UBG8T2BTR-BC

Function: 32Gb(4096M x 8bit)Legacy MLC NAND Flash

Package: TSOP-48/SDP Type

Manufacturer: Hynix

Image:

h27ubg8t2btr-bc-mlc-nand-flash

Description

The product part NO.H27UBG8T2BTR-BC is a single 3.3V 32GbitNAND flash memory. The Device contains 2 planes in a single die. Each plane is made up of the 1,024 blocks. Each block consists of 256 programmable pages. Each page contains 8,832bytes. The pages are subdivided into an 8,192byte main data storage area with a spare 640byte district. Page program operation can be performed in typical 1300us, and a single block can be erased in typical 3.5ms.

Pinout

h27ubg8t2btr-bc-datasheet-pinout

 

Features

1. Multi Level Cell(MLC) Technology

2. NAND Interface

(1) x8 bus width

(2) Multiplexed address/ Data

(3) Pin-out compatibility for all densities

3. Multi-Plane Architecture

(1) Two independent planes architecture

(2) Parallel operations on both planes available, effectively halving program, read and erase time

(3) Command Set-ONFI 2.2 Compliant Command Set-Interleaved

H27UBG8T2BTR-BC Datasheet

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