Part Number: 93LC46B

Function: 1K Microwire Compatible Serial EEPROM

Package: SOIC 8 Pin Type

Manufacturer: Microchip Technology

Images:

Description

The Microchip Technology Inc. 93XX46A/B/C devices are 1Kbit low-voltage serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as the 93AA46C, 93LC46C or 93C46C are dependent
upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the
93AA46A, 93LC46A or 93C46A devices are available, while the 93AA46B, 93LC46B and 93C46B devices
provide dedicated 16-bit communication.

EEPROM stands for Electrically Erasable Programmable Read-Only Memory. It is a type of non-volatile memory used in computers, microcontrollers, and other electronic devices to store data that must be retained even when the power is turned off. EEPROM is a variation of ROM (Read-Only Memory) that can be both programmed and erased electrically.

2 page

Features

• Low-Power CMOS Technology

• ORG Pin to Select Word Size for ‘46C’ Version

• 128 x 8-bit Organization ‘A’ Devices (no ORG)

• 64 x 16-bit Organization ‘B’ Devices (no ORG)

• Self-Timed Erase/Write Cycles (including Auto-Erase)

• Automatic Erase All (ERAL) Before Write All (WRAL)

• Power-On/Off Data Protection Circuitry

• Industry Standard 3-Wire Serial I/O

• Device Status Signal (Ready/Busy)

• Sequential Read Function

93LC46B PDF Datasheet

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Part Number: IC-554

Function: DIMM 72 pin Memory Socket

Package: Module Type

Manufacturer: Yamaichi Electronics

Images:

Description

This is DIMM 72 pin Socket.

Socket Series Design No. N: Without Mounting Flange MF: With Mounting Flange Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute 30m½ max. at 10mA/20mV (Initial) -55ûC ~ +170ûC Material PEI (Glass Filled) Beryllium Copper Gold over Nickel Insulator:

Contact: Plating: 98.00 ±0.4 89.00 ±0.2 80.00 ±0.4 0.635 ±0.1 1.27×35=44.45 ±0.2 1.27×17=21.59 REF 1.27×18=22.86 REF. 1.27 ±0.1 C IC-554-1 2-DIA3.20 Thru Hole 17.00 17.78 6.35 59.69 0.67 +0.1 0 1.27 ±0.1 1.27×35=44.45 –0.2 25.35 Front 54.00 +0.2 0 7.62 1.02 ±0.03 1.27 ±0.03 44.45 ±0.05 1.00 +0.09 -0.07 Back (2.00) 51.66 1.27×35=44.45 ±0.05 (1.27×17=21.59) 2.00 (Position of IC) (1.27×18=22.86) 2-1.80 ±0.05 17.78 1.80 Back Detail C (Back) IC Device Dimensions (Reference Dra wing) IC Device Dimensions (Reference Drawing) 98.00 REF . 89.00 ±0.1 1.27×35=44.45 ±0.1 (1.27×17=21.59) (1.27×18=22.86) 1.27 ±0.05 0.635 ±0.05 M AX 30 8.04 ±0.05 4.84 ±0.05 .00 ∞ 2-DIA.3.20 +0.1 0 Thru Hole 1.27 ±0.05 1.27×35=44.45 ±0.1 P.C.BOARD HOLE PATTERN Pattern Shown Looking Down Through Top of Socket. 72-DIA0.80 +0.1 0 Thru Hole (Position of IC) For Positioning Pin 2.30 ±0.1 SEC. D-D 35 […]

IC-554 PDF Datasheet