30F121 PDF Datasheet – 300V, 120A, IGBT, GT30F121

Part Number: 30F121, GT30F121

Function: 300V, 120A, IGBT

Package: TO-220SIS Type

Manufacturer: Toshiba

Image :
30F121 image, Toshiba IGBT

Description

The 30F121 is 300V, 120A, IGBT.  IGBT is Insulated Gate Bipolar Transistor.

An IGBT consists of a P-N-P-N structure with an insulated gate, which is used to control the flow of current between the emitter and collector terminals. When a positive voltage is applied to the gate terminal, it creates a conducting channel between the emitter and collector, allowing current to flow. When the gate voltage is removed, the channel is turned off, and the IGBT becomes an open switch.

The IGBT has several advantages over traditional power semiconductors, such as bipolar transistors and MOSFETs, making it a popular choice for high-power applications. These advantages include high voltage and current handling capability, fast switching speed, low switching losses, and low on-state resistance.

Features of the Toshiba Discrete IGBTs

1. IGBTs combine the MOSFET advantage of high input impedance with the bipolar transistor
advantage of high-voltage drive.

2. The conductivity modulation characteristics of a bipolar transistor make it ideal for load control
applications that require high breakdown voltage and high current.

3. Toshiba offers a family of fast switching IGBTs, which are low injection and recombination in the
carrier.

 

30F121 Data :

30F121 PDF Datasheet

The Toshiba discrete IGBTs are available in high-voltage and high-current ratings. They are used in
inverter and power conversion circuits for such diverse applications as motor drivers, uninterruptible
power supply (UPS) systems, IH cookers, plasma display panels (PDPs), strobe flashes and so on.

(1) IGBTs also featuring fast switching

(2) Low collector-emitter saturation voltage even in the large current area

(3) IGBTs featuring a built-in diode with optimal characteristics tailored to specific applications

(4) High input impedance allows voltage drives

(5) Available in a variety of packages

Pinouts:

30F121 Pinout

Plasma Display :

Previously, MOSFETs were used for the power supplies of plasma display panels (PDPs). Recently, however, MOSFETs are being replaced by IGBTs, which have lower VCE(sat)in a large current area.

Applications:

1. Plasma Display Panel

30F121 PDF Datasheet
30F121 pdf

Other data sheets are available within the file: 35F121, 30F122, GT30F121

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30F131 Datasheet PDF – 360V, 200A, IGBT, GT30F131 – Toshiba

Part Number: 30F131, GT30F131

Function: Discrete IGBT 360V, 200A

Package: TO-220SM(MXN)

Manufacturer: Toshiba

Image

30F131 image

 

Description

The 30F131 is 360V, 200A, IGBT. The IGBT is insulated-gate bipolar transistor.

IGBT stands for Insulated-Gate Bipolar Transistor. It is a type of power semiconductor device that combines the advantages of bipolar transistors (high voltage and current handling capability) and field-effect transistors (fast switching and low on-state resistance).

They are also used in applications where high voltage and high current are required, such as in welding equipment and induction heating.

An IGBT consists of a P-N-P-N structure with an insulated gate, which is used to control the flow of current between the emitter and collector terminals. When a positive voltage is applied to the gate terminal, it creates a conducting channel between the emitter and collector, allowing current to flow.

Product Lineup

30F131 datasheet

30F131 Applications : Plasma display panels

Features of the Toshiba Discrete IGBTs

The Toshiba discrete IGBTs are available in high-voltage and high-current ratings. They are used in inverter and power conversion circuits for such diverse applications as motor drivers, uninterruptible power supply (UPS) systems, IH cookers, plasma display panels (PDPs), strobe flashes and so on.

(1) IGBTs also featuring fast switching
(2) Low collector-emitter saturation voltage even in the large current area
(3) IGBTs featuring a built-in diode with optimal characteristics tailored to specific applications
(4) High input impedance allows voltage drives
(5) Available in a variety of packages

 

Pinout

pinout

Construction:

The basic structure of the planar IGBT consists of four layers (pnpn), as shown in the following figure. Low saturation voltage is achieved by using a pnp transistor to allow conductivity modulation during conduction.

Prior to the development of IGBTs, power MOSFETs were used for power amplifier applications which require high input impedance and fast switching. However, at high voltages, the on-state resistance rapidly increases as the breakdown voltage increases. It is thus difficult to improve the conduction loss of power MOSFETs.

Other data sheets are available within the file: GT30F131

 

30F131 Datasheet PDF Download

30F124 pdf
GT30F131
GT30F131

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