Rectifier

BAW56 Datasheet PDF – 75V, 350mW, Switching Diode – Panjit

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Part Number: BAW56

Function: Dual Switching Diode

Package: SOT-23 Type

Manufacturer: PANJIT INTERNATIONAL

Pinouts:

BAW56 datasheet

Description

1. Fast switching speed.

2. Surface mount package Ideally Suited for Automatic insertion

3. Electrically Identical to Standard JEDEC

4. High Conductance

Pinout

BAW56 pinout

 

BAW56 is a small signal diode. It has high-speed switching characteristics and low leakage current. By using this diode, various functions such as high-frequency signal processing, signal clamping, switching, and rectification can be implemented.

 

Mechanical data

1. Case : SOT-23, Plastic

2. Terminals : Solderable per MIL-STD-202, Method 208

3. Approx. Weight : 0.008 gram

 

Applications

1. High-frequency circuits: The BAW56 is used in RF circuits because of its excellent ability to handle high-frequency signals.

2. Signal clamping: It is used in clamp circuits that limit the maximum voltage of an input signal.

3. Switching: It is suitable as a switching element in digital circuits due to its high-speed switching characteristics.

4. Rectification: It is used in rectifier circuits that convert AC signals to DC.

 

 

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Other data sheets are available within the file: BAL99, BAV70, BAV99

BAW56 Datasheet PDF Download


BAW56 pdf

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BYX71 Datasheet PDF – Fast Soft-Recovery Rectifier Diode

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Part Number: BYX71

Function: Fast Soft-Recovery Rectifier Diode

Package:  SOD-38 Type

Manufacturer: ETC

Images:

BYX71 datasheet diode

Description

Silicon double-diffused rectifier diodes in plastic envelopes. They are intended for use in chopper applications as well as switched-mode power supplies, as efficiency diodes and scan rectifiers in television receivers. The devices featurenon-snap-off characteristics. Normal and reverse polarity types are available.

Pinout:

BYX71 pinout diode

Mechanical Data

1. Net mass : 2,5 g
2. Recommended diameter of fixing screw : 3,5 mm
3. Torque on screw
when using washer and heats ink compound:

(1) min. 0,95 Nm (9,5 kg cm)
(2) max. 1,5 Nm (15 kg cm)

BYX71-350

SOLDERING AND MOUNTING NOTES

1. Soldered joints must be at least 2,5 mm from the seal.
2. The maximum permissible temperature of the soldering iron or bath is 270 °C;
contact with the joint must not exceed 3 seconds.
3. The device should not be immersed in oil, and few potting resins are suitable for
re-encapsulation. Advice on these materials is available on request.
4. Leads should not be bent less than 2,5 mm from the seal; exert no axial pull when
bending.
5. For good thermal contact heatsink compound should be used between base-plate and
heats ink.

Other data sheets are available within the file: BYX71-350, BYX71-600, BYX71-350R, BYX71-600R

BYX71 Datasheet PDF

BYX71 pdf


 

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